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Low Profile Heat Pipe Assembly | |||
| Technology, Inc. | ||||
| High Performance Heat Sinks | ||||
| Extruded Heat Sinks | Application for Low Profile Heat Sink Assembly | |||
| Chipset / CPU Coolers |
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| Heat Pipes | ||||
| Power Heat Pipe Assembly | ||||
| Low Profile Heat Pipe Assembly | ||||
| Thermoelectric Cooling Modules | ||||
| Heat Pump (TECM) Assembly | ||||
| Stamped Heat Sink / Product | ||||
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modern electronic devices getting smaller and hotter, most engineers are
challenged by solving problem of cooling large heat load with constrained
space. Low profile heat pipe assemblies are perfect for meeting this
challenge. The heat pipe remove the heat from the heat source to the
fin stack where it is dissipated to the environment either by nature
convection or forced convection.
Each design is tailored to the specific application. Most of the assemblies are consist of heat sink or metal plate, heat pipe, slim blower, thermal interface material. Heat sinks can be extruded, die caste, stack
fined and the material can be aluminum or copper. |
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6081 Dales Street, Unit C Buena Park, CA 90621 USA |
Tel: (714) 739
- 5797 |
Sales@ACKTechnology.com |
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