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Power Heat Pipe Assembly | |||
| Technology, Inc. | ||||
| High Performance Heat Sinks |
Application for Heat Pipe Assembly |
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| Extruded Heat Sinks |
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| Chipset / CPU Coolers | ||||
| Heat Pipes | ||||
| Power Heat Pipe Assembly | ||||
| Low Profile Heat Pipe Assembly | ||||
| Thermoelectric Cooling Modules | ||||
| Heat Pump (TECM) Assembly | ||||
| Stamped Heat Sink / Product | ||||
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| Sample Size: L=14", W=7", H=2.75"
Application: Specification: |
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Efficient Heat Transfer Device |
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A.
Sample Size: L-7", W=3.5"m H=4" B.
Sample Size: |
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A. Cooling Device for Processor |
B. Cooling Device for Instrument |
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Cooling Device for Power Electronics
Sample Size: |
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6081 Dales Street, Unit C Buena Park, CA 90621 USA |
Tel: (714) 739
- 5797 |
Sales@ACKTechnology.com |
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