Power Heat Pipe Assembly  
     Technology, Inc.      
 

Products  |  Application Notes Contact Us | Company

 
   High Performance Heat Sinks

      Application for Heat Pipe  Assembly

 
   Extruded Heat Sinks
  • Personal Computers
  • Communications
  • Power Electronics
  • Medical Equipment
  • Consumer Electronics
  • Automotive Electronics
  • Test Equipment
  • Instrumentation
 
   Chipset / CPU Coolers  
   Heat Pipes  
   Power Heat Pipe Assembly  
   Low Profile Heat Pipe Assembly  
   Thermoelectric Cooling Modules  
   Heat Pump (TECM) Assembly  
   Stamped Heat Sink / Product

     Sample Size:
 
 L=14", W=7", H=2.75"

   Application:
  
Electronic Device
   Cooling Unit

   Specification:
 
 
f8, L=350 mm
   Thermal Resistance = 0.8 oC/W
   (Natural Convection)
   Operating Range: 0 oC ~ 320 oC

 

Efficient Heat Transfer Device


 

A.   Sample Size:
L-7", W=3.5"m H=4"

B.   Sample Size:
L=6", W=1.25", H=1.25"

 

 

 A.  Cooling Device for Processor

B.  Cooling Device for Instrument


     Cooling Device for Power Electronics

   Sample Size:
  
L=9", W=3.5", H=7.5"

 

      6081 Dales Street, Unit C
   Buena Park, CA 90621  USA

Tel: (714) 739 - 5797
Fax:(714) 739 - 5898

Sales@ACKTechnology.com

 
 

Products Application Notes  |  Contact Us  | Company

 
   

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